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The flexible heating foil is the result of printed circuit technology (etched foil) and was developed in order to solve specific problems in advanced market sectors such as the space and aviation fields.


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The flexible heating foil is the result of printed circuit technology (etched foil) and was developed in order to solve specific problems in advanced market sectors such as the space and aviation fields.

In a relatively short time, the heating foil has found applications in many other fields, allowing users to solve problems of particular importance thanks to the following characteristics.


Specifications:

  • Can be set to vary heat concentrations to optimize distribution
  • Minimum heat dipersion in case of external application on the object to be heated
  • Can be molded
  • Easy to assemble
  • Overall economical in many applications

Minimum weight, thickness and flexible working temperature

  • Mica 0,9 mm/max working temp. 500° C
  • Polyimide 0,15 mm/max working temp. 260° C with adhesive 175° C
  • Silicone 0,8 mm/max working temp. 200° C with adhesive 175° C
  • Poliestere 0,15-0,25 mm/max working temp. 100° C with adhesive 100° C
  • Teflon 0,8 mm

Specifications:

  • Can be set to vary heat concentrations to optimize distribution
  • Minimum heat dipersion in case of external application on the object to be heated
  • Can be molded
  • Easy to assemble
  • Overall economical in many applications

Minimum weight, thickness and flexible working temperature

  • Mica 0,9 mm/max working temp. 500° C
  • Polyimide 0,15 mm/max working temp. 260° C with adhesive 175° C
  • Silicone 0,8 mm/max working temp. 200° C with adhesive 175° C
  • Poliestere 0,15-0,25 mm/max working temp. 100° C with adhesive 100° C
  • Teflon 0,8 mm

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